DocumentCode :
3108723
Title :
Packaging for wireless technology
Author :
Monthei, D.
Author_Institution :
TriQuint Semicond. Inc., Hillsboro, OR, USA
fYear :
1997
fDate :
12-15 Oct. 1997
Firstpage :
33
Lastpage :
36
Abstract :
This paper discusses some of the typical packages being used for wireless applications today and how they are "modified" for high frequency use. Also discussed are electrical modeling concerns of packages, PC board layout and a number of other factors impacting part performance. Choices in parasitic circuit topology are discussed along with EM simulation and comparison to measured data.
Keywords :
code division multiple access; digital radio; packaging5801694; radio equipment; EM simulation; PC board layout; electrical modeling; high frequency performance; packaging; parasitic circuit topology; wireless technology; Automation; Ceramics; Circuit simulation; Costs; Frequency; MMICs; Plastic packaging; Semiconductor device packaging; Sockets; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1997. Technical Digest 1997., 19th Annual
Conference_Location :
Anaheim, CA, USA
ISSN :
1064-7775
Print_ISBN :
0-7803-4083-3
Type :
conf
DOI :
10.1109/GAAS.1997.628231
Filename :
628231
Link To Document :
بازگشت