Title :
Packaging for wireless technology
Author_Institution :
TriQuint Semicond. Inc., Hillsboro, OR, USA
Abstract :
This paper discusses some of the typical packages being used for wireless applications today and how they are "modified" for high frequency use. Also discussed are electrical modeling concerns of packages, PC board layout and a number of other factors impacting part performance. Choices in parasitic circuit topology are discussed along with EM simulation and comparison to measured data.
Keywords :
code division multiple access; digital radio; packaging5801694; radio equipment; EM simulation; PC board layout; electrical modeling; high frequency performance; packaging; parasitic circuit topology; wireless technology; Automation; Ceramics; Circuit simulation; Costs; Frequency; MMICs; Plastic packaging; Semiconductor device packaging; Sockets; Testing;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1997. Technical Digest 1997., 19th Annual
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-4083-3
DOI :
10.1109/GAAS.1997.628231
