Title :
Effect Of Ion-bombardment Intensity Due To The Charging On Sidewall Trench Formatiom
Author :
Lee, H.C. ; Beckx, S. ; Vanhaelemeersch, S.
Author_Institution :
IMEC
Keywords :
Bonding; Electrons; Etching; Fabrication; Fluid flow; Large Hadron Collider; Plasma applications; Resists; Silicon; Surface charging;
Conference_Titel :
Plasma Process-Induced Damage, 1997., 2nd International Symposium on
Conference_Location :
Monterey, California, USA
Print_ISBN :
0-9651-5771-7
DOI :
10.1109/PPID.1997.596753
