DocumentCode :
3109410
Title :
Comparative Study on System Model and Finite Element Analysis of a Monolithic 3DOF MEMS Capacitive Accelerometer
Author :
Khan, Shuja M. ; Bazaz, Shafaat A. ; Abid, Muhammad
Author_Institution :
Facuity of Electron. Eng., Ghulam Ishaq Khan Inst. of Eng. Sci. & Technol., Swabi, Pakistan
fYear :
2009
fDate :
16-18 Dec. 2009
Firstpage :
524
Lastpage :
528
Abstract :
This paper presents a comparative study on the design of a monolithic 3DOF MEMS capacitive accelerometer using both analytical and numerical techniques. Monolithic accelerometer is a single structure having three individual single axis accelerometers on a single substrate and utilizes a surface micromachining technology using standard PolyMUMPs process. The designed accelerometer is 3mm×3.1mm in size, has 10.17¿ g/¿Hz and 17.50¿ g/¿Hz mechanical noise floor for in-plane and out-of-plane axes respectively. The total sense capacitance along x, y and z-axes is 68.5fF, 82.3fF and 6.19pF respectively. Sensitivity of 0.65fF/g, 0.78fF/g and 0.90pF/g is obtained for in-plane (x and y) and out-of-plane (z) axes respectively. Performing a detailed finite element analysis in ANSYS software, a displacement of 19.058¿m, 20.392¿m and 1.318¿m for x, y and z axes respectively are calculated approximately the same as calculated analytically under applied acceleration to the proof mass of the proposed accelerometer.
Keywords :
accelerometers; capacitance; finite element analysis; micromachining; micromechanical devices; monolithic integrated circuits; ANSYS software; PolyMUMPs process; capacitive accelerometer; distance 1.318 mum; distance 19.058 mum; distance 20.392 mum; finite element analysis; in-plane axes; individual single axis accelerometers; mechanical noise floor; monolithic 3DOF MEMS design; monolithic accelerometer; out-of-plane axes; sense capacitance; surface micromachining technology; system model; Accelerometers; Capacitance; Design engineering; Fingers; Finite element methods; Information analysis; Micromachining; Micromechanical devices; Performance analysis; Process design; 3D Accelerometer; ANSYS; MEMS; PolyMUMPs; monolithic;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information and Multimedia Technology, 2009. ICIMT '09. International Conference on
Conference_Location :
Jeju Island
Print_ISBN :
978-0-7695-3922-5
Type :
conf
DOI :
10.1109/ICIMT.2009.93
Filename :
5381154
Link To Document :
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