Title :
Effects of electrostatic discharge on GaAs-based HBTs
Author_Institution :
TI Syst. MMIC R&D, Raytheon, Dallas, TX, USA
Abstract :
Short term and long term effects of electrostatic discharge (ESD) on GaAs-based HBTs are described. Both single-finger and multi-finger devices were tested, at ESD levels from 300 to 8000 V. Typically, devices subject to ESD show increasing levels of leakage current and/or decreased breakdown voltages. ESD effects on single and multi-finger devices are discussed, as well as the effects of ballasting. Finally, the results of long-term bias stress on ESD exposed devices is described.
Keywords :
III-V semiconductors; electric breakdown; electrostatic discharge; gallium arsenide; heterojunction bipolar transistors; leakage currents; 300 to 8000 V; GaAs; GaAs HBT; ballast; bias stress; breakdown voltage; electrostatic discharge; leakage current; multi-finger device; single-finger device; Degradation; Electronic ballasts; Electrostatic discharge; Fingers; Gallium arsenide; Heterojunction bipolar transistors; L-band; Schottky diodes; Stress; Testing;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1997. Technical Digest 1997., 19th Annual
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-4083-3
DOI :
10.1109/GAAS.1997.628258