DocumentCode
3111566
Title
Membrane probe card technology (the future for higher performance wafer test)
Author
Leslie, Brian ; Matta, Farid
Author_Institution
Hewlett Packard Co., Palo Alto, CA, USA
fYear
1988
fDate
12-14 Sep 1988
Firstpage
601
Lastpage
607
Abstract
A probe card technology is described that addresses the needs of testing VLSI devices at the wafer level. This technology offers the ability to test high-pin count devices at operating speed with the same performance as obtained in package test. The design and performance characteristics of two implementations are summarized and the results of several applications are reviewed
Keywords
VLSI; integrated circuit testing; IC testing; VLSI devices; flexible dielectric membrane; high-pin count devices; membrane probe card technology; wafer test; Biomembranes; Circuit testing; Electronic equipment testing; Frequency; Integrated circuit packaging; Laboratories; Maintenance; Probes; Transmission lines; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1988. Proceedings. New Frontiers in Testing, International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-8186-0870-6
Type
conf
DOI
10.1109/TEST.1988.207842
Filename
207842
Link To Document