DocumentCode :
3111730
Title :
Pain generation model on upper limb considering the laminated structure of skin
Author :
Matsunaga, Nobutomo ; Akayama, Seiko ; Kawaji, Shigeyasu
Author_Institution :
Grad. Sch. of Sci. & Technol., Kumamoto Univ., Kumamoto
fYear :
2008
fDate :
12-15 Oct. 2008
Firstpage :
1097
Lastpage :
1102
Abstract :
In the coexistence circumstance with humans and robots, sensory and emotional feeling of human should be considered when the robots interact to human. A typical unpleasant feeling at interaction is pain. One approach for construction of safety coexistence circumstance with humans is to design the autonomous robot with action learning ability based on the subjective pain. In previous researches, a superficial pain model caused by impact has been studied and the transmission mechanism focused on the input-output relations was proposed. However, the generation mechanism of the pain has not been clarified yet. In this paper, a new slow pain model is proposed considering the laminated structure of skin. It is clarified that the strain energy density (SED) is related to the subjective pain level by FEM simulations. From the experimental results, it is confirmed that proposed model is effective for simulation of the subjective pain.
Keywords :
finite element analysis; human-robot interaction; mobile robots; skin; FEM simulations; autonomous robot design; emotional feeling; human-robot interaction; humans; pain generation model; sensory feeling; skin; slow pain model; strain energy density; subjective pain; upper limb; Biological system modeling; Capacitive sensors; Human robot interaction; Orbital robotics; Pain; Robot control; Robot sensing systems; Robotics and automation; Safety; Skin; deformation; laminated structure; pain model; skin; strain energy density;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems, Man and Cybernetics, 2008. SMC 2008. IEEE International Conference on
Conference_Location :
Singapore
ISSN :
1062-922X
Print_ISBN :
978-1-4244-2383-5
Electronic_ISBN :
1062-922X
Type :
conf
DOI :
10.1109/ICSMC.2008.4811428
Filename :
4811428
Link To Document :
بازگشت