Title :
Advanced multichip module packaging of microelectromechanical systems
Author :
Butler, Jeffrey T. ; Bright, Victor M. ; Comtois, John H.
Author_Institution :
Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
Abstract :
Multichip module (MCM) packaging provides an efficient solution to integration of MEMS with microelectronics. In this paper, new methods of packaging MEMS using two advanced MCM foundry processes are described. A special purpose surface micromachined MEMS packaging test chip was designed and fabricated. The MEMS test die was packaged with CMOS electronics die using the “chips first” General Electric high density interconnect (HDI) technology and the Micro Module System MCM-D process
Keywords :
CMOS integrated circuits; integrated circuit interconnections; integrated circuit packaging; micromachining; micromechanical devices; multichip modules; CMOS electronics die; MCM-D process; MEMS; advanced MCM foundry processes; high density interconnect; microelectromechanical systems; multichip module packaging; surface micromachining; test die; Circuit testing; Electronics packaging; Foundries; Integrated circuit interconnections; Integrated circuit packaging; Microelectromechanical systems; Microelectronics; Micromechanical devices; Monitoring; Multichip modules;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613633
