• DocumentCode
    3112042
  • Title

    Trouble-shooting: a key to process improvement

  • Author

    Yau, Chi W. ; Chang, Song-Lin ; Jordan, Bruce F. ; Schwermann, Joe J. ; Wellman, Joan A.

  • Author_Institution
    AT&T Eng. Res. Center, Princeton, NJ, USA
  • fYear
    1988
  • fDate
    12-14 Sep 1988
  • Firstpage
    796
  • Lastpage
    803
  • Abstract
    The authors present a problem-solving methodology that consists of four basic steps-collecting data, identifying problems, uncovering root causes, and taking action. With the recent advance in computer-integrated manufacturing (CIM), endeavors to improve the process have been greatly eased by the deployment of such systems as ILIAD and MPCS. It is described how some of the tools provided by these systems have been successfully used to carry out the methodology steps in process improvement. For clarification, two case studies conducted on a CIM line are presented. The first deals with reducing test-repair cycles; the second is aimed at yield improvement. A methodology is described that is aimed at reducing the manufacturing cost in general, and the trouble-shooting cost in particular. It is argued that trouble-shooting and yield are closely related, i.e. superior trouble-shooting capability is the prerequisite to process, or yield improvement, and that increased yield necessarily results in decreased repair cost
  • Keywords
    CAD/CAM; automatic testing; economics; integrated circuit testing; printed circuit testing; production testing; software packages; CIM; IC testing; ILIAD; MPCS; case studies; computer-integrated manufacturing; failure mode analysis; manufacturing cost; production testing; repair cost; test-repair cycles; trouble-shooting cost; yield improvement; Cities and towns; Computer aided manufacturing; Computer integrated manufacturing; Costs; Failure analysis; Feedback; Manufacturing processes; Problem-solving; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1988. Proceedings. New Frontiers in Testing, International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-8186-0870-6
  • Type

    conf

  • DOI
    10.1109/TEST.1988.207866
  • Filename
    207866