Comparing full lateral metallization and reference plane stitching in LTCC boards for satellite applications

In this paper a methodology for taking into account the frequency dependence of a possible referencing (grounding) techniques in LTCC boards for satellite applications is presented. The aim of this work is to analyze and compare the input impedance and S-parameters values for different strategies of inter connection of the reference planes among them. The numerical analysis presented has proven the importance of the lateral metallization set up in the LTCC board working into a metal housing. For board used stand alone the lateral metallization can be replaced by an adequate density of vias stitching among the planes. The modelling agrees well with real grounding solution.