A new model for substrate heat spreading to two convective heat sinks: Application to the BGA package

Author

Kabir, Humayun ; Ortega, Alfonso

Author_Institution

Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA

fYear

1998

fDate

10-12 Mar 1998

Firstpage

24

Lastpage

30

Abstract

The thermal heat conduction from a circular heat source to a circular conductive substrate exposed to distinct convective heat sinks on its upper and lower surfaces is treated rigorously by formally solving a mixed boundary value problem through the singular integral equation technique. The effects of the two heat sinks are consolidated into one effective heat sink that is derived by application of a current source transformation to the DC circuit representation of the problem. The utility of the model is shown by applying it to a compact thermal model of a ball grid array (BGA) package

Keywords

boundary-value problems; convection; heat conduction; heat sinks; integrated circuit packaging; surface mount technology; temperature distribution; thermal analysis; BGA package; DC circuit representation; ball grid array package; circular conductive substrate; circular heat source; compact thermal model; convective heat sink pair; convective heat sinks; current source transformation; distinct convective heat sinks; effective heat sink; heat sinks; lower surface heat sink; mixed boundary value problem; singular integral equation technique; substrate heat spreading model; thermal heat conduction; upper surface heat sink; Electronic packaging thermal management; Geometry; Heat engines; Heat sinks; Heat transfer; Immune system; Surface resistance; Surface treatment; Temperature dependence; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE

Conference_Location

San Diego, CA

ISSN

1065-2221

Print_ISBN

0-7803-4486-3

Type

conf

DOI

10.1109/STHERM.1998.660383

Filename

660383