• DocumentCode
    3113192
  • Title

    Process simulator for plasma enhanced sputter deposition system

  • Author

    Miyagawa, Y. ; Tanaka, Mitsuru ; Nakadate, H. ; Nakao, S. ; Miyagawa, S.

  • Author_Institution
    Nat. Ind. Res. Inst. of Nagoya, Japan
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    213
  • Lastpage
    216
  • Abstract
    “NEPTUNE/Sputter”, a new process simulator for a plasma enhanced sputter deposition system has been developed which includes simulation modules for plasma behavior, the sputtering process, the transport of sputtered particles and the deposition processes. The particle-in-cell (PIC) and the Monte Carlo collision (MCC) approaches have been combined into a PIC-MCC module for self-consistent simulations of low-temperature collisional plasmas and the background gas. This approach is based on the weighting collision simulation scheme allowing for disparate number densities and time scales of different species. The sputtering process induced by energetic ions which incident on the target surface is simulated by the dynamic Monte Carlo module (SASA-sp: the sputtering version of dynamic-SASAMAL code). The transport of sputtered particles is simulated by the direct simulation Monte Carlo module (DSMC) considering sputtered particles as neutrals. Some results obtained for a DC magnetron sputter deposition system such as plasma behavior, time evolution of sputtered particle distribution in the plasma, the thickness fluctuation of the deposited film, etc. are presented
  • Keywords
    Monte Carlo methods; plasma simulation; sputter deposition; sputtering; Monte Carlo collision; NEPTUNE/Sputter; SASA-sp; background gas; deposition processes; direct simulation Monte Carlo module; disparate number densities; dynamic Monte Carlo module; low-temperature collisional plasmas; particle-in-cell; plasma behavior; plasma enhanced sputter deposition system; process simulator; self-consistent simulations; simulation modules; sputtered particle distribution; sputtering process; thickness fluctuation; time evolution; time scales; weighting collision simulation scheme; Electric potential; Electrodes; Magnetic fields; Monte Carlo methods; Plasma applications; Plasma density; Plasma simulation; Plasma temperature; Plasma transport processes; Sputtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924127
  • Filename
    924127