Title :
Application results of a new thermal benchmark chip
Author :
Szekely, V. ; Rencz, Marta ; Courtois, B.
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest
Abstract :
A 1.2 μm CMOS thermal benchmark chip has been designed, fabricated and tested. The chip is aimed at supporting various steady-state and transient measurements, e.g. surface temperature gradients, heating and cooling curves, in-chip thermal couplings, etc. It facilitates the calibration of various types of chip temperature mapping equipment. After the presentation of the chip design, experimental results are shown and evaluated in order to demonstrate the wide applicability of this measurement support tool
Keywords :
CMOS integrated circuits; calibration; cooling; heating; integrated circuit measurement; integrated circuit packaging; measurement standards; temperature distribution; thermal analysis; 1.2 micron; CMOS thermal benchmark chip; CMOS thermal benchmark chip design; CMOS thermal benchmark chip fabrication; CMOS thermal benchmark chip testing; calibration; chip design; chip temperature mapping equipment; cooling curves; heating curves; in-chip thermal couplings; measurement support tool; steady-state measurements; surface temperature gradients; thermal benchmark chip; transient measurements; Benchmark testing; Cooling; Electrical resistance measurement; Frequency; Packaging; Semiconductor device measurement; Sensor phenomena and characterization; Temperature sensors; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-4486-3
DOI :
10.1109/STHERM.1998.660384
