• DocumentCode
    3113253
  • Title

    Simulation of ultra-low energy ion implantation from a remote plasma source using Monte Carlo techniques

  • Author

    Puchner, Helmut ; Sukharev, Valeriy ; Aronowitz, Sheldon

  • Author_Institution
    LSI Logic Corp., Santa Clara, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    224
  • Lastpage
    227
  • Abstract
    We present simulation as well as experimental data for ultra-low energy nitrogen ion implants from a remote nitrogen plasma source. Nitrogen plasma ion implantation is used to create highly effective diffusion barriers for dopants. We used a commercially available plasma etch tool to create a diffusion barrier for boron in a p-channel CMOS device to avoid boron penetration as well as to decrease the electrical thickness of the gate oxide. We employ a Monte Carlo ion implantation tool to simulate the penetration depth as well as doping levels for the nitrogen plasma doping
  • Keywords
    CMOS integrated circuits; Monte Carlo methods; diffusion barriers; ion implantation; nitrogen; plasma materials processing; semiconductor doping; semiconductor process modelling; sputter etching; Monte Carlo techniques; dopants; doping levels; electrical thickness; gate oxide; highly effective diffusion barriers; nitrogen ion implants; nitrogen plasma doping; p-channel CMOS device; penetration depth; plasma etch tool; remote plasma source; simulation; ultra-low energy ion implantation; Boron; Doping; Implants; Ion implantation; Nitrogen; Plasma applications; Plasma devices; Plasma immersion ion implantation; Plasma simulation; Plasma sources;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924130
  • Filename
    924130