DocumentCode :
3113253
Title :
Simulation of ultra-low energy ion implantation from a remote plasma source using Monte Carlo techniques
Author :
Puchner, Helmut ; Sukharev, Valeriy ; Aronowitz, Sheldon
Author_Institution :
LSI Logic Corp., Santa Clara, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
224
Lastpage :
227
Abstract :
We present simulation as well as experimental data for ultra-low energy nitrogen ion implants from a remote nitrogen plasma source. Nitrogen plasma ion implantation is used to create highly effective diffusion barriers for dopants. We used a commercially available plasma etch tool to create a diffusion barrier for boron in a p-channel CMOS device to avoid boron penetration as well as to decrease the electrical thickness of the gate oxide. We employ a Monte Carlo ion implantation tool to simulate the penetration depth as well as doping levels for the nitrogen plasma doping
Keywords :
CMOS integrated circuits; Monte Carlo methods; diffusion barriers; ion implantation; nitrogen; plasma materials processing; semiconductor doping; semiconductor process modelling; sputter etching; Monte Carlo techniques; dopants; doping levels; electrical thickness; gate oxide; highly effective diffusion barriers; nitrogen ion implants; nitrogen plasma doping; p-channel CMOS device; penetration depth; plasma etch tool; remote plasma source; simulation; ultra-low energy ion implantation; Boron; Doping; Implants; Ion implantation; Nitrogen; Plasma applications; Plasma devices; Plasma immersion ion implantation; Plasma simulation; Plasma sources;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
Type :
conf
DOI :
10.1109/.2000.924130
Filename :
924130
Link To Document :
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