• DocumentCode
    3113327
  • Title

    A finite element method for transient analysis of power electronic motor drives including parasitic capacitive effect and external circuit

  • Author

    Fu, W.N. ; Ho, S.L.

  • Author_Institution
    Hong Kong Polytech. Univ., Hong Kong
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A two dimensional (2-D) finite element method (FEM) of transient electromagnetic field for modeling power electronic motor drives is presented. The proposed method takes into account the parasitic capacitive effect and can be coupled with arbitrarily connected circuits. The FEM formulation which includes the displacement current in the direction of the modelpsilas depth is deduced. The displacement current effect in the plane of the solution domain is represented by coupling the circuit of capacitances into the FEM equations. By introducing additional unknowns, the final set of the system equations has a symmetrical coefficient matrix. A method using electric charge as an excitation for the computation of the capacitance matrix is also proposed for reducing the computation time. The developed algorithm has been applied to simulate systems with power sources having high frequency and/or high dv/dt.
  • Keywords
    capacitance; electromagnetic fields; finite element analysis; matrix algebra; motor drives; power electronics; transient analysis; capacitance matrix; displacement current effect; parasitic capacitive effect; power electronic motor drives; symmetrical coefficient matrix; transient electromagnetic field analysis; two dimensional finite element method; Coupling circuits; Electromagnetic fields; Electromagnetic transients; Equations; Finite element methods; Motor drives; Power electronics; Symmetric matrices; Transient analysis; Two dimensional displays; circuit; displacement current; electromagnetic field; finite element method; motor; parasitic capacitance; power electronic; transient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652021
  • Filename
    4652021