DocumentCode
3113327
Title
A finite element method for transient analysis of power electronic motor drives including parasitic capacitive effect and external circuit
Author
Fu, W.N. ; Ho, S.L.
Author_Institution
Hong Kong Polytech. Univ., Hong Kong
fYear
2008
fDate
18-22 Aug. 2008
Firstpage
1
Lastpage
6
Abstract
A two dimensional (2-D) finite element method (FEM) of transient electromagnetic field for modeling power electronic motor drives is presented. The proposed method takes into account the parasitic capacitive effect and can be coupled with arbitrarily connected circuits. The FEM formulation which includes the displacement current in the direction of the modelpsilas depth is deduced. The displacement current effect in the plane of the solution domain is represented by coupling the circuit of capacitances into the FEM equations. By introducing additional unknowns, the final set of the system equations has a symmetrical coefficient matrix. A method using electric charge as an excitation for the computation of the capacitance matrix is also proposed for reducing the computation time. The developed algorithm has been applied to simulate systems with power sources having high frequency and/or high dv/dt.
Keywords
capacitance; electromagnetic fields; finite element analysis; matrix algebra; motor drives; power electronics; transient analysis; capacitance matrix; displacement current effect; parasitic capacitive effect; power electronic motor drives; symmetrical coefficient matrix; transient electromagnetic field analysis; two dimensional finite element method; Coupling circuits; Electromagnetic fields; Electromagnetic transients; Equations; Finite element methods; Motor drives; Power electronics; Symmetric matrices; Transient analysis; Two dimensional displays; circuit; displacement current; electromagnetic field; finite element method; motor; parasitic capacitance; power electronic; transient;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location
Detroit, MI
Print_ISBN
978-1-4244-1699-8
Electronic_ISBN
978-1-4244-1698-1
Type
conf
DOI
10.1109/ISEMC.2008.4652021
Filename
4652021
Link To Document