DocumentCode
3113969
Title
Performance of IW-630 ion implanter for 300-mm wafers
Author
Nishihashi, T. ; Yokoo, H. ; Hisamune, T. ; Shimizu, T. ; Fukui, R. ; Suzuki, H. ; Kageyama, K. ; Niikura, K. ; Fuwa, K. ; Oka, T. ; Kashimoto, K. ; Fujiyama, J. ; Sakurada, Y.
Author_Institution
ULVAC Japan Ltd., Kanagawa, Japan
fYear
2000
fDate
2000
Firstpage
392
Lastpage
395
Abstract
While micro-fineness of semiconductor devices is taking place rapidly, improvements of ion implanters have also been made to achieve flexible use in advanced facilities. IW-630 is a 300-mm ion implanter that provides as small as 17.2 m2 footprint, wide energy range and wide dosage range in order to satisfy the requirements in the advanced facilities. The energy range from 5 to 300 keV is achieved using single-charged ions. In high-energy implantation using multiple-charged ions, energy contamination is free by the final energy filter (collimator magnet) installed after post-acceleration. The implantation dose shift and the degradation of implantation uniformity by out-gassing from photo-resist, which mostly occurs at the time of implanting high-power beams, have been completely solved by ULVAC original cryo-pumping systems. So stable implantation characteristics have been achieved. In wafer handling, unlike the batch system or cassette-load lock system, the load-lock system adopted handles wafers one by one. The practical transfer system and the implant processing capacities realize 200 wafers/hr as the row throughput
Keywords
beam handling equipment; cryopumping; ion implantation; photoresists; semiconductor doping; 300 mm; 300-mm wafers; 5 to 300 keV; IW-630 ion implanter; cryo-pumping; dose shift; energy contamination; energy filter; footprint; high-energy implantation; implantation uniformity; load-lock system; micro-fineness; multiple-charged ions; out-gassing; photo-resist; post-acceleration; semiconductor devices; single-charged ions; wafer handling; wide dosage range; wide energy range; Acceleration; Contamination; Degradation; Filters; Fluid flow; Implants; Investments; Ion implantation; Resists; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology, 2000. Conference on
Conference_Location
Alpbach
Print_ISBN
0-7803-6462-7
Type
conf
DOI
10.1109/.2000.924170
Filename
924170
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