Digital to RF coupling analysis methodology for mixed-signal systems

Author

Lim, Dongsoon ; Yongsup Kim ; Kim, Yongsup

Author_Institution

Samsung Electron. Co., Ltd., Suwon

fYear

2008

fDate

18-22 Aug. 2008

Firstpage

1

Lastpage

5

Abstract

Digital harmonics could be coupled to a RF system in a digital & RF mixed signal board or a package. The coupled digital harmonic could reduce the RF sensitivity of the system, or cause a system failure. Digital to RF coupling is the most important factor of degrading mixed-signal systems. The analysis methodology of evaluating the RF performance reflected by the digital harmonics is addressed. In this paper, proposed methodology has been applied to RF receiver hardware and verified by 3D electromagnetic simulation.

Keywords

couplings; failure analysis; harmonic analysis; sensitivity analysis; system-in-package; 3D electromagnetic simulation; RF coupling analysis methodology; RF receiver hardware; RF sensitivity; digital coupling analysis methodology; digital harmonics; mixed-signal systems; system failure; system-in-package; Degradation; Frequency domain analysis; Harmonic analysis; Mobile handsets; Modems; Packaging; RF signals; Radio frequency; Signal analysis; Time domain analysis; RF sensitivity; System-in-Package (SiP); coupled noise; harmonic;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on

Conference_Location

Detroit, MI

Print_ISBN

978-1-4244-1699-8

Electronic_ISBN

978-1-4244-1698-1

Type

conf

DOI

10.1109/ISEMC.2008.4652067

Filename

4652067