Title : 
A 6.4Gbps on-chip eye opening monitor circuit for signal integrity analysis of high speed channel
         
        
            Author : 
Shin, Minchul ; Shim, Jongjoo ; Kim, Jaemin ; Pak, Jun So ; Hwang, Chulsoon ; Yoon, Changwook ; Kim, Joungho ; Kim, Hyungsoo ; Park, Kunwoo ; Kim, Yongju
         
        
            Author_Institution : 
Dept. of EECS, Korea Adv. Inst. of Sci. & Technol., Daejeon
         
        
        
        
        
        
            Abstract : 
In this paper, an on-chip eye opening monitor circuit has been proposed with 4 ps time and 4 mv voltage resolutions for analyzing signal integrity of on-chip high speed channel. The proposed eye opening monitor circuit can detect the maximum 6.4 Gbps data rate and give eye diagrams depending on on-chip high speed channel conditions. The performance of the proposed eye opening monitor circuit was verified by using a general Spice simulations and showed the variations of eye diagram of 6.4 Gbps random data when on-die terminations of on-chip high speed channel was changed from 50 ohm to 80 ohm.
         
        
            Keywords : 
SPICE; circuit simulation; detector circuits; digital signal processing chips; system-on-chip; Spice simulations; bit rate 6.4 Gbit/s; eye diagrams; on-chip eye opening monitor circuit; on-chip high speed channel; on-die terminations; signal integrity analysis; time 4 ps; voltage 4 mV; Circuit simulation; Clocks; Data communication; Distortion measurement; Equalizers; Integrated circuit interconnections; Monitoring; Semiconductor device packaging; Signal analysis; Signal resolution; Eye diagram; Eye opening monitor; high resolution; high speed channel; on-die termination; signal integrity;
         
        
        
        
            Conference_Titel : 
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
         
        
            Conference_Location : 
Detroit, MI
         
        
            Print_ISBN : 
978-1-4244-1699-8
         
        
            Electronic_ISBN : 
978-1-4244-1698-1
         
        
        
            DOI : 
10.1109/ISEMC.2008.4652099