Title :
Noise coupling between signal and power/ground nets due to signal vias transitioning through power/ground plane pair
Author :
Fan, Jun ; Cocchini, Matteo ; Archambeault, Bruce ; Knighten, James L. ; Drewniak, James L. ; Connor, Samuel
Author_Institution :
UMR/MS & T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
Abstract :
Signal vias are often used to move a signal from one PCB layer to another. As a result, these vias can penetrate power/ground plane pair and cause noise coupling (crosstalk) between signal and power/ground nets. This paper studies the noise coupling mechanism using a segmentation approach combined with a via capacitance model and a plane-pair cavity model. Noise coupling from signal to power/ground, and vice versa, is demonstrated in the modeling results.
Keywords :
capacitance; crosstalk; printed circuits; signal processing equipment; PCB layer; capacitance model; crosstalk; noise coupling; power/ground nets; power/ground plane pair; segmentation approach; signal nets; signal vias transitioning; Capacitance; Capacitors; Coupling circuits; Crosstalk; Equivalent circuits; Frequency; Geometry; Impedance; Integrated circuit modeling; Voltage; Noise coupling; cavity model; signal and power/ground nets; signal via transition; via capacitance;
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
DOI :
10.1109/ISEMC.2008.4652117
