DocumentCode :
3115370
Title :
Therma-wave dose sensitivity considerations, including energy dependence
Author :
Kamenitsa, Dennis ; Lillian, Peter ; Luckman, Greg ; Becker, Klaus ; Colvin, Neil ; Rendon, Michael ; Bokharey, Zuhair
Author_Institution :
Axcelix Technol. Inc., Austin, TX, USA
fYear :
2000
fDate :
2000
Firstpage :
674
Lastpage :
677
Abstract :
Therma-wave (TW) dose measurement is one of the standard technologies used in the semiconductor field to monitor the process of ion implantation. One of the main advantages of this technique, in addition to its nondestructiveness and the lack of additional processing, is the wide range of implant conditions (dose and energy) over which the technique is effective. However, it has long been recognized that there can be substantial variations in the dose sensitivity of this technique depending on the TW value. The plot of dose sensitivity (defined as % change TW / % change dose) vs. therma wave value results in a “V” shaped function, usually demonstrating a minimum value near 600-700 therma wave units. This dose sensitivity minimum can significantly effect the ability to properly monitor implant dose variations near this minimum. In order to better characterize this sensitivity variation, a matrix of wafers was implanted with variations in both dose and energy with sufficient dose resolution to provide useful sensitivity data. The variation in dose for boron implants was from 5×1011 to 1×1014 ions/cm2 and in energy from 3 to 500 keV. Wafers were also implanted with phosphorus and arsenic over a similar dose range with somewhat different variations in the energy range. The basic sensitivity characteristic reported in the literature was demonstrated with a “V” shaped pattern being evident. What was unexpectedly observed was that there was a change in the value of the minimum of the sensitivity as the implant energy was varied. For the conditions studied there was a significant change in the minimum sensitivity value as the implant energy was changed, ranging from 0.083 at 3 keV to 0.223 at 2 MeV. In addition it appeared that the location of the minimum, with respect to the TW value may have also shifted, varying from near 500 TW units to almost 700 TW units. The significance of these variations in the therma wave sensitivity response at different energies is discussed along with possible causes
Keywords :
arsenic; boron; dosimetry; elemental semiconductors; ion implantation; phosphorus; process monitoring; silicon; 0.083 to 3 keV; 0.223 to 2 MeV; 3 to 500 keV; Si:As; Si:B; Si:P; V shaped function; dose sensitivity vs therma wave value plot; implant dose monitoring; implant energy; minimum sensitivity value; therma wave sensitivity response; therma-wave dose sensitivity; wafer ion implantation; Boron; Energy resolution; Implants; Ion implantation; Measurement standards; Monitoring; Signal resolution; Silicon; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
Type :
conf
DOI :
10.1109/.2000.924243
Filename :
924243
Link To Document :
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