DocumentCode :
3115554
Title :
Advances in cross-contamination control using single-wafer, high-current implantation
Author :
Todorov, S.S. ; Bertuch, A. ; Piscitello, W. ; Eddy, R. ; Robertson, T.
Author_Institution :
Varian Semicond. Equip. Associates Inc., Gloucester, MA, USA
fYear :
2000
fDate :
2000
Firstpage :
715
Lastpage :
718
Abstract :
The Varian VIISta 80 is a single-wafer high-current implanter, which uses a ribbon beam and a single-direction mechanical scan for implantation. The placement of the wafers on an electrostatic platen, and the absence of end station parts in the vicinity of the wafer during implant, translate into an expected advantage in implanter memory over batch tools. This paper focuses on P-in-As cross-contamination and compares the performance of the VIISta 80 to a representative of the batch family of high-current tools-the Varian VIISion 80. The results of experiments designed to understand the mechanisms of phosphorus build-up in machine parts exposed to the P+ beam, as well as their cleanup by a variety of subsequent ion beams, are discussed in detail. Phosphorus levels in arsenic-implanted wafers are assessed using secondary ion mass spectrometry (SIMS) and four-point probe sheet resistance measurements. Typical cross-contamination performance is presented and recommendations on further reduction of the memory effects are made. Additionally, data on P-in-B, B-in-As, and B-in-P cross-contamination modes are reported
Keywords :
arsenic; boron; doping profiles; elemental semiconductors; ion implantation; mass spectroscopic chemical analysis; phosphorus; process control; secondary ion mass spectra; semiconductor doping; silicon; B-in-As cross-contamination modes; B-in-P cross-contamination modes; P-in-As cross-contamination; P-in-B cross-contamination modes; P+ beam; SIMS; Si:B,P,As; Varian VIISion 80; Varian VIISta 80; arsenic-implanted wafers; batch tools; cleanup; cross-contamination control; electrostatic platen; four-point probe sheet resistance; implanter memory; phosphorus build-up; phosphorus levels; ribbon beam; secondary ion mass spectrometry; single-direction mechanical scan; single-wafer high-current implantation; single-wafer high-current implanter; Electrical resistance measurement; Electrostatics; Implants; Ion beams; Mass spectroscopy; Probes; Silicon; Surface contamination; Tail; Wheels;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
Type :
conf
DOI :
10.1109/.2000.924253
Filename :
924253
Link To Document :
بازگشت