PCB ground fill design guidelines for radiated EMI

Author

Pan, Weifeng ; Pommerenke, David ; Xu, Shuai ; Jia, Jun

Author_Institution

EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO

fYear

2008

fDate

18-22 Aug. 2008

Firstpage

1

Lastpage

6

Abstract

This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

Keywords

electromagnetic interference; electromagnetic shielding; printed circuit design; resonators; PCB ground fill design guideline; electromagnetic shielding; excitation structure; radiated EMI; resonator; Capacitance; Electromagnetic compatibility; Electromagnetic interference; Guidelines; Inductance; Laboratories; Magnetic noise; Resonance; Resonant frequency; Voltage; EMI; Ground fill; PCB; design guideline;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on

Conference_Location

Detroit, MI

Print_ISBN

978-1-4244-1699-8

Electronic_ISBN

978-1-4244-1698-1

Type

conf

DOI

10.1109/ISEMC.2008.4652141

Filename

4652141