DocumentCode :
3116075
Title :
Comprehensive material characterization and method of its validation by means of FEM simulation
Author :
Gromala, P. ; Duerr, I. ; Dressler, M. ; Jansen, K.M.B. ; Hawryluk, M. ; De Vreugd, I.
Author_Institution :
Automotive Electron., Robert Bosch GmbH, Reutlingen, Germany
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42377
Lastpage :
42590
Abstract :
Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of thermal expansion were measured and implemented into commercially available FEM code Ansys. Fringe pattern technique has been used to measure warpage of bimaterial strips. Then FEM simulation of bimaterial strips were done and compared with experimental results. Curing shrinkage has been modeled in an effective way. Its accuracy has been checked on one of the materials by creating bimaterial strips with three different geometrical dimensions, that is varied thickness of mold and copper substrate.
Keywords :
curing; finite element analysis; moulding; substrates; FEM code Ansys; FEM material modeling; FEM simulation; bimaterial strips; boundary condition; coefficient; copper substrate; curing shrinkage; fringe pattern technique; geometry; material characterization; modulus of elasticity; mold substrate; numerical simulation; product design; thermal expansion; warpage; Compounds; Curing; Electromagnetic compatibility; Finite element methods; Heating; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765770
Filename :
5765770
Link To Document :
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