Integrating microstrip filters using LTCC technology for microwave purposes

Author

Leitgeb, Erich ; Birnbacher, U.

fYear

2002

fDate

18-19 Nov. 2002

Firstpage

24

Lastpage

29

Abstract

This paper presents planar microwave and millimeter wave filters in interdigital and combline technique for HIPERLAN applications and integration in LTCC-modules. All filters were simulated on dielectric ceramic with ε_r=7.8 and 18. The coupling behaviour of striplines and microstrip lines on this ceramic material was investigated first. The design and simulation of LTCC bandpass filters, the design parameters of which were extracted from an existing ceramic resonator filter design, named hybrid-type, is also reported. The simulated results of both, classic interdigital and hybrid-type, show a satisfying performance in insertion loss, bandwidth and steepness when integrated in LTCC modules.

Keywords

band-pass filters; ceramic packaging; dielectric resonator filters; microstrip couplers; microstrip filters; microwave filters; millimetre wave filters; modules; permittivity; HIPERLAN; LTCC modules; bandpass filters; bandwidth; combline filters; dielectric ceramic permittivity; hybrid-type ceramic resonator filters; insertion loss; interdigital filters; microstrip filter integration; microwave low temperature cofired ceramic technology; planar microwave/mm-wave filters; steepness; stripline/microstrip line coupling behaviour; Band pass filters; Ceramics; Dielectrics; Microstrip filters; Microwave filters; Microwave technology; Microwave theory and techniques; Millimeter wave technology; Resonator filters; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on

Print_ISBN

0-7803-7530-0

Type

conf

DOI

10.1109/EDMO.2002.1174925

Filename

1174925