Title :
Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Author :
Pufall, R. ; Goroll, M. ; Mahler, J. ; Kanert, W. ; Bouazza, M. ; Wittler, O. ; Dudek, R.
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
Abstract :
High temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesion to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronic components heat is generated locally (bond wire or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or the bond wires.
Keywords :
adhesion; delamination; metallisation; moulding; adhesion; bond wire; button shear test; chip encapsulation; delamination; electronic component heat; metallisation; moulding compound; stress test; Adhesives; Compounds; Copper; Force; High temperature superconductors; Materials reliability;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
DOI :
10.1109/ESIME.2011.5765786
