DocumentCode
3116425
Title
The microfabrication of capacitive ultrasonic transducers
Author
Jin, X.C. ; Ladabaum, I. ; Yakub, B. T Khuri
Author_Institution
Edward L. Ginzton Lab., Stanford Univ., CA, USA
Volume
1
fYear
1997
fDate
16-19 Jun 1997
Firstpage
437
Abstract
The successful fabrication of surface micromachined ultrasonic transducers is reported. In a key step of the microfabrication, amorphous silicon is used as a sacrificial layer to form sealed nitride cavities. The process is fully CMOS compatible and allows for improved geometric control compared to previously reported work. Transmission experiments in both water and air are presented. A dynamic range in excess of 110 dB is observed in air at 2.3 MHz. In water, a single pair of transducers is able to operate from 2 MHz to 20 MHz. When tuned, a 3 MHz tone burst results in a received signal with better than 60 dB signal to noise ratio. The transducer behavior agrees with theoretical understanding of transducer dynamics
Keywords
capacitance measurement; etching; micromachining; photolithography; ultrasonic transducers; ultrasonic transmission; underwater sound; 2 to 20 MHz; CMOS compatibility; SPEEDIE simulation; Si; Si3N4-Si; air; amorphous Si sacrificial layer; capacitive ultrasonic transducers; dynamic range; etching selectivity; geometric control; lithography; microfabrication; micromachined ultrasonic transducers; received signal; sealed nitride cavities; signal to noise ratio; single transducer pair; surface micromachining; tone burst; transducer dynamics; transmission experiments; water; Amorphous silicon; Biomedical transducers; Biomembranes; CMOS process; Electrodes; Etching; Fabrication; Piezoelectric transducers; Ultrasonic imaging; Ultrasonic transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-3829-4
Type
conf
DOI
10.1109/SENSOR.1997.613679
Filename
613679
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