A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging

Author

Weltevreden, E.R. ; Erinc, M. ; Tesarski, S.J. ; Wymyslowski, A. ; Mavinkurve, A. ; Giele, A.W.J.

Author_Institution

TNO, Eindhoven, Netherlands

fYear

2011

fDate

18-20 April 2011

Firstpage

42373

Lastpage

42464

Abstract

Delamination of mating interfaces can cause serious reliability problems in different application areas. The causes of delamination are multiple. In the case of leadframe-based chip packages, a critical interface is that between the leadframe and the moulding compound. Delamination can magnify stress levels at the interface and can lead to fatigue of interconnects. The objective of this study is to evaluate the influence of different causes of delamination on degradation of the leadframe compound interface by means of simulation, supported by targeted experiments. To this end two models have been devised, which show good convergence. However the different simulations are not yet compatible with each other and need to be validated.

Keywords

delamination; filled polymers; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; moulding; thermal management (packaging); thermal stress cracking; electronic packaging; interconnect fatigue; leadframe based chip package; mating interface delamination; moulding compound; reliability problems; silica filled epoxy; stress levels; thermo-mechanical behaviour; Copper; Data models; Geometry; Lead; Optimization; Presses; Resins;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on

Conference_Location

Linz

Print_ISBN

978-1-4577-0107-8

Type

conf

DOI

10.1109/ESIME.2011.5765792

Filename

5765792