Title :
A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging
Author :
Weltevreden, E.R. ; Erinc, M. ; Tesarski, S.J. ; Wymyslowski, A. ; Mavinkurve, A. ; Giele, A.W.J.
Author_Institution :
TNO, Eindhoven, Netherlands
Abstract :
Delamination of mating interfaces can cause serious reliability problems in different application areas. The causes of delamination are multiple. In the case of leadframe-based chip packages, a critical interface is that between the leadframe and the moulding compound. Delamination can magnify stress levels at the interface and can lead to fatigue of interconnects. The objective of this study is to evaluate the influence of different causes of delamination on degradation of the leadframe compound interface by means of simulation, supported by targeted experiments. To this end two models have been devised, which show good convergence. However the different simulations are not yet compatible with each other and need to be validated.
Keywords :
delamination; filled polymers; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; moulding; thermal management (packaging); thermal stress cracking; electronic packaging; interconnect fatigue; leadframe based chip package; mating interface delamination; moulding compound; reliability problems; silica filled epoxy; stress levels; thermo-mechanical behaviour; Copper; Data models; Geometry; Lead; Optimization; Presses; Resins;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
DOI :
10.1109/ESIME.2011.5765792
