Title :
An adaptive device impedance matching circuit
Author_Institution :
Semicond. Test Div., Teradyne Inc., Agoura Hills, CA, USA
Abstract :
Test engineers have been frustrated in their efforts to perform accurate functional testing of high speed VLSI devices on commercial ATE because of the impedance mismatch between the device and the ATE pin electronics. This mismatch between the low device output impedance and high ATE test station impedance causes signal reflections (´ringing´) that interfere with testing. This paper will describe a circuit that effectively eliminates the problem of signal reflections. In contrast to earlier proposed solutions, this circuit is simple to understand and use.<>
Keywords :
VLSI; automatic test equipment; impedance matching; integrated circuit testing; ATE; functional testing; high speed VLSI devices; impedance matching circuit; output impedance; pin electronics; signal reflections; test station impedance; Circuit testing; Delay effects; Electronic equipment testing; Impedance matching; Reflection; Resistors; Semiconductor device testing; System testing; Very large scale integration; Voltage;
Conference_Titel :
VLSI Test Symposium, 1991. 'Chip-to-System Test Concerns for the 90's', Digest of Papers
Conference_Location :
Atlantic City, NJ, USA
DOI :
10.1109/VTEST.1991.208146