DocumentCode :
3116558
Title :
Optical coupling of planar III-V pin photodiodes and SOI waveguides using an integrated BCB prism
Author :
Moerl, Ludwig ; Passenberg, Wolfgang ; Ferstl, Margit ; Schmidt, Detlef ; Zhang, Ruiyong ; Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami
Author_Institution :
Fraunhofer Inst. for Telecommun., Heinrich-Hertz-Inst., Berlin, Germany
fYear :
2010
fDate :
May 31 2010-June 4 2010
Firstpage :
1
Lastpage :
4
Abstract :
Vertical hybrid integration of photodiodes (PD) and silicon-on-insulator (SOI) waveguides has been investigated. To this end, InP-based planar detectors were used onto which a polymer prism was formed to turn the light beam into the vertical direction. The photodiodes were flip-chip mounted onto a SOI waveguide platform using thermo-compression bonding. Comparable high responsivity of around 0.75 A/W was obtained when light was coupled directly into the prism as well as via a SOI waveguide. The responsivity for SOI integrated PDs was found to depend only to a minor extent on input wavelength and polarization. PD bandwidth of up to 10 GHz was measured. The investigated optical coupling scheme proved to work well also when integrating a PD with an array of ten SOI waveguides which are combined with a star coupler.
Keywords :
III-V semiconductors; indium compounds; optical waveguides; photodiodes; silicon-on-insulator; InP; SOI waveguides; flip-chip; integrated BCB prism; light beam; optical coupling; planar III-V pin photodiodes; planar detectors; polymer prism; silicon-on-insulator waveguides; thermo-compression bonding; vertical hybrid integration; Bonding; III-V semiconductor materials; Optical arrays; Optical coupling; Optical planar waveguides; Optical waveguides; PIN photodiodes; Planar waveguides; Polymers; Silicon on insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide & Related Materials (IPRM), 2010 International Conference on
Conference_Location :
Kagawa
ISSN :
1092-8669
Print_ISBN :
978-1-4244-5919-3
Type :
conf
DOI :
10.1109/ICIPRM.2010.5516229
Filename :
5516229
Link To Document :
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