Title :
Polymer micro-heat-pipe for InP/InGaAs technologies
Author :
Liu, Wai Y. ; Mohammadi, Saeed ; Katehi, Linda P B ; Khalkhali, Hamed ; Kurabayashi, Katsuo
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
This paper reports a polymer micro-heat-pipe technology suitable for cooling of InP/InGaAs power devices. This technology eliminates the needs for high-temperature wafer-to-wafer bonding and can be carried out at a temperature below 110°C. By estimation from the measured data, the effective thermal conductivity of a fabricated micro-heat-pipe suggests that this technology can serve as a potential solution to some thermal management problems in InP/InGaAs processes.
Keywords :
III-V semiconductors; cooling; gallium arsenide; heat pipes; indium compounds; integrated circuit design; integrated circuit manufacture; integrated circuit measurement; integrated circuit packaging; micromachining; microwave integrated circuits; polymer gels; thermal conductivity; thermal management (packaging); 110 degC; InP-InGaAs; InP/InGaAs microwave integrated circuits; effective thermal conductivity; gel-casting techniques; high-temperature wafer-to-wafer bonding; microfabrication; micromachining; polymer micro-heat-pipes; power device cooling; thermal management; Conductivity measurement; Cooling; Indium gallium arsenide; Indium phosphide; Polymers; Technology management; Temperature; Thermal conductivity; Thermal management; Wafer bonding;
Conference_Titel :
Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
Print_ISBN :
0-7803-7530-0
DOI :
10.1109/EDMO.2002.1174945
