• DocumentCode
    3116603
  • Title

    Different approaches for integrating HBTs and EAMs

  • Author

    Reimann, T. ; Schneider, M. ; Neumann, S. ; Jäger, D. ; Tegude, F.J.

  • Author_Institution
    Solid-State Electron. Dept., Duisburg Univ., Germany
  • fYear
    2002
  • fDate
    18-19 Nov. 2002
  • Firstpage
    149
  • Lastpage
    154
  • Abstract
    We compare three different approaches to combine heterojunction bipolar transistors (HBTs) and electroabsorption waveguide modulators (EAMs) for building monolithically integrated opto-electronic circuits: A single stage HBT-driver is applied to an EAM load where the HBT layer stack is grown onto the EAM-layer structure. This is compared to a merged integration of HBTs and EAMs with the waveguide inside the transistor layers with separate devices, and a merged device called HBT-EAM. The compact layer structure and processing supports the concept of this merged device.
  • Keywords
    electro-optical modulation; electroabsorption; heterojunction bipolar transistors; integrated circuit design; integrated circuit measurement; integrated optoelectronics; EAM loads; EAM-layer structure; HBT layer stack; HBT-drivers; HBT/EAM integration; electroabsorption waveguide modulators; heterojunction bipolar transistors; integrated optoelectronic circuits; merged integration; optical absorption; Circuits; Heterojunction bipolar transistors; Optical modulation; Optical refraction; Optical variables control; Optical waveguides; Resistors; Stimulated emission; Voltage; Waveguide junctions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
  • Print_ISBN
    0-7803-7530-0
  • Type

    conf

  • DOI
    10.1109/EDMO.2002.1174946
  • Filename
    1174946