DocumentCode :
3116657
Title :
Performance evaluation of an automotive distributed architecture based on HPAV communication protocol using a transaction level modeling approach
Author :
Majdoub, Takieddine ; Nours, Sébastien Le ; Pasquier, Olivier ; Nouvel, Fabienne
Author_Institution :
IREENA, Univ. Nantes, Nantes, France
fYear :
2011
fDate :
2-4 Nov. 2011
Firstpage :
1
Lastpage :
8
Abstract :
Due to increasing complexity of communication infrastructures in the automotive domain, reliable models are necessary in order to assist designers in the development process of networked embedded systems. In this context, transaction level modeling, supported by languages as SystemC, is a promising solution to assess performances of networked architectures with a good compromise between accuracy and simulation speed. This article presents the application of a specific modeling approach for performance evaluation of a networked embedded system inspired from the automotive domain. The considered approach is illustrated by the modeling of a video transmission system made of three electronic controller units and based on a specific power line communication protocol. The created model incorporates description of various communication layers and simulation of the model allows evaluation of time properties and memory cost inferred.
Keywords :
carrier transmission on power lines; protocols; video communication; HPAV communication protocol; SystemC; automotive distributed architecture; electronic controller units; networked embedded systems; power line communication protoco; transaction level modeling; video transmission system; Automotive engineering; Computer architecture; Embedded systems; IP networks; Load modeling; Protocols; Time division multiple access; distributed architecture; performance evaluation; transaction level modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Architectures for Signal and Image Processing (DASIP), 2011 Conference on
Conference_Location :
Tampere
Print_ISBN :
978-1-4577-0620-2
Electronic_ISBN :
978-1-4577-0619-6
Type :
conf
DOI :
10.1109/DASIP.2011.6136848
Filename :
6136848
Link To Document :
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