DocumentCode :
3116857
Title :
Generation of reduced thermal models of electronic systems from transient thermal response
Author :
Janicki, Marcin ; Zubert, Mariusz ; Napieralski, Andrzej
Author_Institution :
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42373
Lastpage :
42464
Abstract :
This paper presents a methodology for the creation of reduced thermal models of electronic systems based on the knowledge of the system dynamic temperature response. The registration of thermal responses using equidistant sampling on a logarithmic time scale allows the proper identification of all the time constants in the responses. Knowing the entire time constant spectrum, it is possible to generate a reduced dynamic thermal model in the form of an RC Cauer ladder with a limited number of stages. This simple model assures not only short simulation time and provides excellent accuracy but also allows the identification of certain physical parameters of a system. The methodology is illustrated in the paper based on the example of discrete power devices attached to a heat sink and cooled with forced air flow. The reduced thermal model is suitable for the direct implementation in the SPICE simulator or almost any other multiphysics simulation environment.
Keywords :
SPICE; electronics packaging; heat sinks; integrated circuits; thermal analysis; transient response; RC Cauer ladder; SPICE simulator; discrete power device; dynamic temperature response; electronic system; equidistant sampling; forced air flow; heat sink; logarithmic time scale; multiphysics simulation environment; physical parameter; thermal model reduction; transient thermal response; Adaptation model; Atmospheric measurements; Electronic packaging thermal management; Materials; Mathematical model; Temperature measurement; Thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765808
Filename :
5765808
Link To Document :
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