Title :
Studies on the reliability of power packages based on strength and fracture criteria
Author :
Dudek, Rainer ; Pufall, Reinhard ; Seiler, Bettina ; Michel, Bernd
Author_Institution :
Micro Mater. Center Chemnitz, Fraunhofer ENAS, Chemnitz, Germany
Abstract :
Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is that after the failure mechanism and if it changes with changed loading type and duration. These questions were addressed by theoretical analyses including coupled transient thermal-mechanical analyses and interface fracture mechanics applying the cohesive zone approach. By the latter, critical states for delamination failures could be derived. Finally, critical interface fracture parameters of the package were compared with results from the button shear test.
Keywords :
delamination; failure (mechanical); fracture mechanics; mechanical testing; packaging; reliability; thermal stress cracking; thermomechanical treatment; coupled transient thermomechanical analysis; delamination failure; fracture criteria; interface fracture mechanics; power package reliability; strength criteria; thermal cycling induced failure; thermal shock test; Deformable models; Electric shock; Heating; Materials; Stress; Thermal analysis;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
DOI :
10.1109/ESIME.2011.5765810