DocumentCode
3116963
Title
Dew-point relative humidity CMOS microsensors
Author
Baglio, S. ; Castorina, S. ; Sacco, V. ; Savalli, N. ; Tringali, C.
Author_Institution
DIEES, Catania Univ., Italy
fYear
2004
fDate
24-27 Oct. 2004
Firstpage
103
Abstract
In this work we present the development of relative humidity (RH) microsensors in standard CMOS technology and bulk micromachining. Miniaturization of RH sensors allows reducing size, response times, power consumption and costs. Our device makes use of dew-point temperature detection approach, to achieve simple operation and high reproducibility. It is based on a suspended plate, anchored to the substrate by means of four arms. The thermoelectric Peltier effect is exploited to cool the plate until an interdigitated capacitor on top of the plate detects moisture and triggers the temperature measurements by means of thermocouples. By measuring dew-point and ambient temperatures, RH can be calculated through psycrometric charts. We report here the modeling, simulation, design and experimental characterization of CMOS RH microsensors.
Keywords
CMOS integrated circuits; Peltier effect; circuit simulation; cooling; electric sensing devices; humidity sensors; integrated circuit design; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microsensors; temperature sensors; thermal management (packaging); CMOS RH microsensors; RH sensor miniaturization; ambient temperatures; anchored suspended plate; bulk micromachining; design; dew-point relative humidity CMOS microsensors; dew-point temperature detection; interdigitated capacitor; modeling; moisture detection; power consumption; psycrometric charts; reproducibility; response times; simulation; standard CMOS technology; thermoelectric Peltier effect plate cooling; CMOS technology; Costs; Delay; Energy consumption; Humidity; Micromachining; Microsensors; Standards development; Temperature sensors; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2004. Proceedings of IEEE
Print_ISBN
0-7803-8692-2
Type
conf
DOI
10.1109/ICSENS.2004.1426110
Filename
1426110
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