DocumentCode
3117109
Title
Microstrip antennas using multi-layer packaging technology
Author
Schweighofer, A. ; Leitgeb, E. ; Birnbacher, U. ; Weinzerl, B. ; Fluhr, H. ; Leitner, M.
Author_Institution
Inst. fur Nachrichtentechnik und Wellenausbreitung, Technische Univ. Graz, Austria
fYear
2002
fDate
18-19 Nov. 2002
Firstpage
265
Lastpage
270
Abstract
This paper presents various microstrip antennas for integration in low-temperature co-fired ceramics (LTCC) technology. The intention was to investigate the characteristics of different antenna concepts. Solutions for increasing the impedance bandwidth and decreasing the size of the antennas were developed. The simulated results of the designed antennas are presented and discussed.
Keywords
ceramic packaging; finite element analysis; method of moments; microstrip antennas; FEM; LTCC integration; antenna size reduction; finite-element-methods; impedance bandwidth; low-temperature co-fired ceramics multilayer technology; method of moments; microstrip antennas; multi-layer packaging technology; Bandwidth; Ceramics; Dielectric substrates; Feeds; Frequency; Impedance; Microstrip antennas; Nonhomogeneous media; Packaging; Patch antennas;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
Print_ISBN
0-7803-7530-0
Type
conf
DOI
10.1109/EDMO.2002.1174969
Filename
1174969
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