DocumentCode :
3117175
Title :
Dynamic Compact Thermal Model for electrothermal modeling and design optimization of automotive power devices
Author :
Azoui, T. ; Tounsi, P. ; Pasquet, G. ; Dupuy, Ph ; Dorkel, J.M.
Author_Institution :
LAAS, CNRS, Toulouse, France
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42375
Lastpage :
42527
Abstract :
In this paper we present a simple methodology for generating dynamic compact thermal model (CTM) of electronics components. Several innovations generating accurate dynamic Compact Thermal Models (CTMs) are proposed in this paper. This makes possible providing customers (automotive systems suppliers) with extended datasheets, including CTMs, without publishing any confidential information about technology, device structures nor materials. The proposed model takes into account the 3D effects of the heat transfer, it considers the effect of the nonlinearity of parameters like thermal conductivity and the dependence of dissipated power on temperature. Moreover, the total number of boundary conditions allowing the generation of boundary condition independent (BCI) compact thermal models is considerably reduced. The method presented in this paper is applied to the extraction of dynamic CTM for automotive power device.
Keywords :
automotive electronics; heat transfer; BCI compact thermal models; CTM; automotive power devices; automotive system suppliers; boundary condition independent compact thermal models; datasheets; design optimization; dynamic compact thermal model; electronic components; electrothermal modeling; heat transfer 3D effects; thermal conductivity; Automotive engineering; Cooling; Generators; Impedance; Logic gates; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765823
Filename :
5765823
Link To Document :
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