DocumentCode
3117286
Title
Impact of the solder joint ageing on IGBT I–V characteristics using 2D physical simulations
Author
Marcault, E. ; Breil, M. ; Bourennane, A. ; Tounsi, P. ; Dupuy, P.
Author_Institution
LAAS, CNRS, Toulouse, France
fYear
2011
fDate
18-20 April 2011
Firstpage
42373
Lastpage
42464
Abstract
Based on 2D mechanical and physical simulations, we explore the impact of solder joint ageing at the origin of power assembly failures, on the electrical characteristics of multi IGBT cells. Electrical characteristics variations are analyzed with the aim of using them for health monitoring of embedded power assemblies.
Keywords
insulated gate bipolar transistors; solders; 2D physical simulations; IGBT I-V characteristics; electrical characteristics variations; embedded power assemblies; health monitoring; power assembly failures; solder joint ageing; Assembly; Computational modeling; Insulated gate bipolar transistors; Lead; Robustness; Silicon; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765829
Filename
5765829
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