DocumentCode :
3117300
Title :
Investigation of ion bombardment of GaAs-based HBTs with InGaAs capping layer
Author :
Subramaniam, S.C. ; Rezazadeh, A.A.
Author_Institution :
Dept. of Electr. Eng. & Electron., Univ. of Manchester Inst. of Sci. & Technol., UK
fYear :
2002
fDate :
18-19 Nov. 2002
Firstpage :
306
Lastpage :
310
Abstract :
We have investigated He+-ion bombardment on a lattice-matched multi-layer In0.5Ga0.5P/GaAs HBT structure with InGaAs capping layer. A single energy implantation of helium-ion was tested on this structure at 600 keV with a dose of 3×1015 cm-2 at room temperature. Post implant annealing was performed for 60 s from 50 to 600°C. A maximum achievable sheet resistance of 2×108 Ω/sq was recorded for the GaAs-based base and collector layers and 3×105 Ω/sq for the emitter-capping layer. Analysis shows that isolation of the whole HBT structure is affected due to the introduction of a narrow-bandgap InGaAs capping layer.
Keywords :
III-V semiconductors; annealing; gallium compounds; helium ions; heterojunction bipolar transistors; indium compounds; ion implantation; semiconductor device measurement; 20 C; 50 to 600 C; 60 s; 600 keV; GaAs-based base/collector layers; HBT structure isolation; He; He+-ion bombardment; InGaAs-InGaP-GaAs; emitter-capping layers; helium-ion single energy implantation dose; heterojunction bipolar transistors; lattice-matched multi-layer HBT structures; maximum achievable sheet resistance; narrow-bandgap InGaAs capping layer GaAs-based HBT; post implant annealing time/temperature; Circuits; Etching; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Implants; Indium gallium arsenide; Isolation technology; Optical materials; Sheet materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
Print_ISBN :
0-7803-7530-0
Type :
conf
DOI :
10.1109/EDMO.2002.1174976
Filename :
1174976
Link To Document :
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