DocumentCode :
3117340
Title :
Thermo-mechanical assessment of solar cell displacement with respect to the viscoelastic behaviour of the encapsulant
Author :
Pander, Matthias ; Dietrich, Sascha ; Schulze, Stefan-H ; Eitner, Ulrich ; Ebert, Matthias
Author_Institution :
Fraunhofer Center for Silicon Photovoltaics CSP, Halle, Germany
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42375
Lastpage :
42527
Abstract :
This paper is proposed to enhance the mechanical simulation model for crystalline solar modules by implementing the viscoelastic behaviour of the encapsulation material ethylene-vinyl acetate (EVA). The material is characterized by thermo-mechanical analysis (TMA) experiments. Utilizing time-temperature superposition techniques a master-curve is constructed and the coefficients for the Williams-Landel-Ferry (WLF)-function are determined. This experimental data is transfered into a numerical representation and validated with creep bending tests of glass-polymer-glass-laminates. In the final step the viscoelastic model is used for calculating the cell displacement during the lamination process, followed by thermal cycling. The results for thermal cycling are compared with an optical cell-displacement measurement within a photovoltaic (PV) module.
Keywords :
bending; creep testing; encapsulation; glass; laminates; polymers; solar cells; viscoelasticity; Williams-Landel-Ferry function; creep bending tests; crystalline solar modules; encapsulant; encapsulation material ethylene-vinyl acetate; glass-polymer-glass-laminates; master-curve; mechanical simulation model; optical cell-displacement measurement; photovoltaic module; solar cell displacement; thermo-mechanical assessment; time-temperature superposition techniques; viscoelastic behaviour; Manganese;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765831
Filename :
5765831
Link To Document :
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