• DocumentCode
    3117362
  • Title

    Development of a drop test methodology for solar cells with FEM simulations

  • Author

    Kraemer, Frank ; Wiese, Steffen

  • Author_Institution
    Univ. of Saarland, Saarbrucken, Germany
  • fYear
    2011
  • fDate
    18-20 April 2011
  • Firstpage
    42374
  • Lastpage
    42495
  • Abstract
    The handling of photovoltaic cells is getting a growing concern. Due to the significant fraction of the material costs on the overall costs of solar wafers the cell thickness was reduced from initially 300 μm down to 200 μm or even 150 μm. At the same time, the size of typical cells remained at 156 × 156 mm2. Thus, solar cells have the same thickness like microelectronic chips but their size is about 10 to 15 times higher. Due to this bad aspect ratio, cells are fragile and breakage is an often observed problem during cell handling in common production lines.
  • Keywords
    finite element analysis; photovoltaic cells; solar cells; FEM; cell handling; drop test methodology; mechanical stress; microelectronic chip; microelectronic product; photovoltaic cell; size 150 mum to 300 mum; solar cell; solar wafer; test methodology; Finite element methods; Load modeling; Loading; Robustness; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
  • Conference_Location
    Linz
  • Print_ISBN
    978-1-4577-0107-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2011.5765832
  • Filename
    5765832