Title :
Bibliography of air cooled heat sinks for thermal enhancement of electronic packages
Author :
Shaukatullah, H.
Author_Institution :
IBM Corp., Endicott, NY, USA
Abstract :
A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are classified in several categories
Keywords :
adhesion; bibliographies; cooling; heat sinks; packaging; thermal analysis; adhesives; air cooled heat sinks; electronic package thermal enhancement; electronic packages; extended surfaces; heat sink bonding adhesives; heat sink design; heat sink performance analysis; Bibliographies; Books; Electronic components; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Heat sinks; Microelectronics; Performance analysis; Thermal management of electronics;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-4486-3
DOI :
10.1109/STHERM.1998.660404
