DocumentCode :
3117465
Title :
Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results
Author :
Weidmann, Diane ; Dubois, Guillaume ; Hertl, Michael ; Chauffleur, Xavier
Author_Institution :
Insidix, Seyssins, France
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42375
Lastpage :
42527
Abstract :
The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.
Keywords :
acoustic microscopy; deformation; electronics packaging; SAM; TDM; debonding localisation; deformation history; electronic packages; interface strength determination; package design; scanning acoustic microscopy; topography and deformation measurements; Joints; Polymers; Temperature dependence; Temperature measurement; Thermomechanical processes; Time division multiplexing; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765836
Filename :
5765836
Link To Document :
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