DocumentCode
311749
Title
Low-sintering PZT-ceramics for advanced actuators
Author
Schönecker, A. ; Gesemann, H.-J. ; Seffner, L.
Author_Institution
Fraunhofer-Inst fur Keramische Technologien & Sinter wekstoffe, Dresden, Germany
Volume
1
fYear
1996
fDate
18-21 Aug 1996
Firstpage
263
Abstract
Much effort has been made to reduce sintering temperature Ts of PZT powders, driven by the demands of multilayer actuator fabrication. Suppression of PbO-evaporation and usability of cost effective electrode materials have been the main reasons. We succeeded in reducing Ts of soft-PZT down to 780°C by creating liquid phases during sintering. Consequently, the fabrication of components with high surface to volume ratio became possible. For example, dense PZT thick films (thickness 50...150 μm) on alumina, showing high remanent polarization (20 μC/cm2) and high mechanical strength were prepared. In order to raise operation frequency and temperature the development of low-sintering hard-PZT has been investigated. This task turned out to be more difficult, because most eutectic additives tend to reduce Curie temperature Tc likewise. Nevertheless, a special modification has been found giving a hard-PZT (i.e. Tc=350°C) that densifies already at Ts=1050°C/2h. The paper reports on our compositional development of low-sintering PZT-ceramics together with its impact on the design and performance of advanced actuators
Keywords
ferroelectric Curie temperature; ferroelectric materials; lead compounds; piezoceramics; piezoelectric actuators; sintering; 1050 C; 780 C; Curie temperature; PZT; PbZrO3TiO3; densification; eutectic additive; ferroelectric; hard-PZT; liquid phase; low-sintering PZT ceramic; mechanical strength; multilayer actuator fabrication; remanent polarization; soft-PZT; thick film; Actuators; Costs; Electrodes; Fabrication; Nonhomogeneous media; Polarization; Powders; Temperature; Thick films; Usability;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
Conference_Location
East Brunswick, NJ
Print_ISBN
0-7803-3355-1
Type
conf
DOI
10.1109/ISAF.1996.602746
Filename
602746
Link To Document