Thermal performance of LED packages for solid state lighting with novel cooling solutions

Author

Zhang, Xiaohua ; Xia, David G W ; Xiaohua Zhang ; Fan, Haining ; Gao, Zhaoli ; Yuen, Matthew M F

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China

fYear

2011

fDate

18-20 April 2011

Firstpage

42376

Lastpage

42558

Abstract

With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.

Keywords

cooling; light emitting diodes; piezoelectricity; thermal management (packaging); 3D fluid structure interaction method; CNT; LED active cooling; LED package thermal performance; air flow velocity field; cooling solutions; heat conduction; high power LED; high thermal performance materials; piezoelectric fans; solid state lighting; Arrays; Diamond-like carbon; Heat sinks; Light emitting diodes; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on

Conference_Location

Linz

Print_ISBN

978-1-4577-0107-8

Type

conf

DOI

10.1109/ESIME.2011.5765839

Filename

5765839