Title :
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Author :
Hölck, O. ; Bauer, J. ; Wittler, O. ; Michel, B. ; Wunderle, B.
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany
Abstract :
An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.
Keywords :
integrated circuit packaging; silicon compounds; EPN; bimaterial molecular models; chip-to-epoxy interfaces; comparative characterization; contact angle determination; contact angle measurements; epoxy phenol novolac; industry-oriented epoxy molding compound; interfacial energies; interfacial interaction; interfacial strength; molecular modeling; silica particles; silicon dioxide layer; Analytical models; Atomic measurements; Electrostatics; Elementary particle vacuum; Lead; Liquids;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
DOI :
10.1109/ESIME.2011.5765840
