DocumentCode
311759
Title
Low temperature preparation of fatigue free Bi4Ti3 O12 thin films by MOCVD and their electrical properties
Author
Kijima, Takeshi ; Nagata, Masaya ; Matsunaga, Hironori
Author_Institution
Functional Devices Lab., Sharp Corp., Chiba, Japan
Volume
1
fYear
1996
fDate
18-21 Aug 1996
Firstpage
323
Abstract
We have investigated the low temperature MOCVD method to form Bi 4Ti3O12 thin films with suitable electrical properties for nonvolatile ferroelectric memory applications. An ultra thin double buffer layer (5nm-Bi4Ti3O12/5nm-TiO2) was used to control the crystallization and a fine grain structure of Bi4Ti3O12 at a low growth temperature was obtained. 100 nm-Bi4Ti3O12 thin films grown at 400°C showed an excellent smooth surface morphology and had good electrical properties, namely, remanent polarization, Pr=11 μC/cm2, coercive field, Ec=90 kV/cm and low leakage current, IL=7×10-9 A/cm2 at 3 V. Additionally, for the first time, fatigue free property was confirmed up to 1×1012 switching cycles. Furthermore, it was found that the Bi4Ti3O12 thin films with a bismuth rich composition showed the (117) preferred orientation and a very large Pr of 23 μC/cm2
Keywords
bismuth compounds; chemical vapour deposition; ferroelectric thin films; titanium compounds; 400 C; Bi4Ti3O12; Bi4Ti3O12 thin film; coercive field; crystallization; electrical properties; fatigue; grain structure; leakage current; low temperature MOCVD; nonvolatile ferroelectric memory; preferred orientation; remanent polarization; surface morphology; switching cycle; ultrathin double buffer layer; Bismuth; Buffer layers; Crystallization; Fatigue; Ferroelectric materials; MOCVD; Nonvolatile memory; Surface morphology; Temperature control; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
Conference_Location
East Brunswick, NJ
Print_ISBN
0-7803-3355-1
Type
conf
DOI
10.1109/ISAF.1996.602759
Filename
602759
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