Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules

Compared with incandescent lamps and fluorescent lamps, nowadays LEDs (Light Emitting Diodes) are power saving, environment-friendly, and have the advantages of long lifetime and flexible color output. Therefore, LEDs are being widely used in many fields. In this paper, three high-power LEDs packaging modules with different packaging structures were selected to do the performance analysis based on the experiments. In the measurement, the LED junction temperature was controlled at seven levels (25°C, 50°C, 65°C, 75°C, 85°C, 95C, 100°C) in sequence. The thermal variation of some photoelectric parameters for LED packaging modules, such as forward voltage, relative flux output, correlated color temperature (CCT), color rending index (Ra), luminous efficiency and spectrum, were focused on and analyzed here. The experimental results demonstrated that the luminous flux, luminous efficacy and forward voltage of LEDs decreased with the increase of the junction temperature, but these three LEDs packaging modules have different varieties on CRI, CCT and spectrum. The related reasons were analyzed briefly in this paper.