Plasma tomography systems for industrial plasma tools

Summary form only given. Addressing the geometry constraints that have inhibited the use of optical emission based tomography systems on industrial plasma tools, the University of Michigan has developed a plasma tomography system which uses optical emission spectroscopy (OES) technology and can be operated from a relatively small window compared to the standard Abel geometry previously used by many authors; this change in geometry may make the technique more applicable to industrial plasma tools, which have relatively small windows. This current sensor´s design, results, and a comparison with findings based on Langmuir probe and other OES methods will be presented. In addition, these results will be compared with spatial etch rate uniformity in the hope of making a jump to process control using a tomography sensor. Plans for future sensor improvements to allow for multipeak analysis and compatibility with more confining geometries will also be presented.