Title :
Module level EMI measurements and estimation
Author_Institution :
Dept. of Electr. Eng., Kyoto Univ., Kyoto
Abstract :
A collection of slides from the authors conference presentation is given.
Keywords :
electromagnetic interference; modules; printed circuits; EMI estimation; EMI measurements; PCB; electromagnetic interference; module level; Circuit testing; Electric variables measurement; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic measurements; IEC standards; Integrated circuit measurements; Integrated circuit noise; Noise measurement; Semiconductor device measurement;
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
DOI :
10.1109/ISEMC.2008.4652244
