DocumentCode :
3117732
Title :
Low cycle fatigue crack growth in nanostructure copper
Author :
Koh, S. ; Saxena, A. ; van Driel, W.D. ; Zhang, G.Q. ; Tummala, R.
Author_Institution :
Delft Inst. of Microsyst. & Nanoelectron. (Dimes), Delft Univ. of Technol., Delft, Netherlands
fYear :
2011
fDate :
18-20 April 2011
Firstpage :
42376
Lastpage :
42558
Abstract :
ITRS has predicted that integrated chip (IC) packages will have interconnections with I/O pitch of 90 nm by the year 2018. Lead-based solder materials in flip chip technology will not be able to satisfy the thermal mechanical requirement these fine pitches. Of all the known interconnect technologies, nanostructure interconnects such as nanocrystalline Cu are the most promising technology to meet the high mechanical reliability and electrical requirements of next generation devices. However, there is a need to fully characterize their fatigue properties. In this research, numerical analysis has been employed to study the semi-elliptical crack growth and shape evolution in nanostructured interconnects subject to uniaxial fatigue loading. The results indicate that nanocrystalline copper is in fact a suitable candidate for ultra-fine pitch interconnects applications. This study also predicts that crack growth is a relatively small portion of the total fatigue life of interconnects under LCF conditions. Hence, crack initiation life is the main factor in determining the fatigue life of interconnects.
Keywords :
copper alloys; fatigue cracks; fine-pitch technology; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; nanostructured materials; numerical analysis; reliability; Cu; flip chip technology; integrated chip packages; lead-based solder materials; low cycle fatigue crack growth; mechanical reliability; nanocrystalline copper; nanostructure copper; nanostructure interconnects; next generation devices; numerical analysis; semielliptical crack growth; size 90 nm; uniaxial fatigue loading; Closed-form solution; Copper; Integral equations; Plastics; Strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
Type :
conf
DOI :
10.1109/ESIME.2011.5765849
Filename :
5765849
Link To Document :
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